2

3

4

5

6

1

GND

N/C

SNS

Exposed Pad

on Bottom

(DAP)

2

3

4

5

6

1

GND

SNS

Exposed Pad

on Bottom

(DAP)

N/C

VOUT

GND

1

2

4

3

5

LP38691, LP38693

SNVS321K – JANUARY 2005 – REVISED APRIL 2013

www.ti.com

Connection Diagrams

Figure 1. PFM (LP38691DT-X.X) – Top View

Figure 2. SOT-223 (LP38693MP-X.X) – Top View

See Package Number NDP0003B

See Package Number NDC0005A

Figure 3. 6-Lead WSON (LP38691SD-X.X) – Top

Figure 4. 6-Lead WSON (LP38693SD-X.X) – Top

View

View

See Package Number NGG0006A

See Package Number NGG

PIN DESCRIPTIONS

Pin

Description

full current operation (250mA maximum per pin).

Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die

GND

and functions as a heat sink when the soldered down to a large copper plane.

Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to

SNS

voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be

The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.

Regulated output voltage

WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.

DAP

See WSON MOUNTING section in APPLICATION HINTS for more information.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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