MPC5601PEF0MLL4R datasheet(40/95 Pages) FREESCALE

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MPC5602P Microcontroller Data Sheet, Rev. 4.1

Freescale Semiconductor

3.5

Thermal characteristics

3.5.1

Package thermal characteristics

3.5.2

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ = TA + (RJA * PD)

Eqn. 1

where:

TA = ambient temperature for the package (°C)

RJA = junction-to-ambient thermal resistance (°C/W)

PD = power dissipation in the package (W)

The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal

performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value

obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which

value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a

single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal

planes is usually appropriate if the board has low power dissipation and the components are well separated.

When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction-to-case thermal resistance

and a case-to-ambient thermal resistance:

RJA = RJC + RCA

Eqn. 2

Table 10. LQFP thermal characteristics

Symbol

Parameter

Conditions

Typical value

Unit

100-pin

64-pin

RJA

Thermal resistance junction-to-ambient, natural

convection1

1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board meets JEDEC specification for

this package.

Single layer board—1s

°C/W

Four layer board—2s2p

°C/W

RJB

Thermal resistance junction-to-board2

2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package. When Greek letters are not available, the symbols are typed as RthJB or Theta-JB.

Four layer board—2s2p

°C/W

RJCtop Thermal resistance junction-to-case (top)3

3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used

for the case temperature. Reported value includes the thermal resistance of the interface layer.

Single layer board—1s

°C/W

JB

Junction-to-board, natural convection4

4 Thermal characterization parameter indicating the temperature difference between the board and the junction temperature per

JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JB.

Operating conditions

°C/W

JC

Junction-to-case, natural convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as

Psi-JC.

Operating conditions

°C/W

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