SODF152SH datasheet(5/7 Pages) LRC

부품명	SODF152SH

상세설명	Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A

PDF	7 Pages

Scroll/Zoom	100%

제조업체	LRC [Leshan Radio Company]

홈페이지	http://www.lrc.cn/

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5 / 7 page

Reel packing

5.Suggested thermal profile for soldering process

1. Storage environment：Temperature=5~40℃ Humidity=55±25%

2. Reflow soldering of surface-mount device

3. Reflow soldering

SODF151-SH thru SODF157-SH

SOD123-FL

3,000

4.0

30,000

183*183*123

178

382*262*387

240,000

8.7

INNER BOX

(mm)

REEL DIA.

(mm)

PACKAGE

REEL SIZE

REEL

(PCS)

COMPONENT

SPACING

(mm)

APPOX.

GROSS

WEIGHT

(kg)

CARTON

SIZE

(mm)

CARTON

(PCS)

BOX

(pcs)

Preheat

- Temperature Min(Tsmin)

- Temperature Max(Tsmax)

- Time(min to max)(ts)

150℃

200℃

60~120sec

Average ramp-up rate(TL to TP)

<3℃/sec

Time 25℃ to Peak Temperature

<6minutes

Time within 5℃ of actual Peak

Temperature(TP)

10~30sec

Ramp-down Rate

<6℃/sec

Profile Feature

Soldering Condition

Tsmax to TL

- Ramp-up Rate

<3sec

Time maintained above:

- Temperature (TL)

- Time(tL)

217℃

60-260sec

Peak Temperature(TP)

255 -0/+5℃

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