© 2000 California Micro Devices Corp. All rights reserved.

11/10/2000

1

WLP200

CALIFORNIA MICRO DEVICES

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

Wafer Level Package Evaluation RC Filter Network

Features

• 6 Filters per device

• Ultra small footprint, 0.5mm pitch

• Silicon substrate

• 0.30mm Eutectic Solder Bumps

Product Description

The WLP200 consists of 6 RC filters with different filter

characteristics in a wafer level package (WLP). All

I/O pins are ESD protected for contact discharges up to

8KV per the IEC1000-4-2 level 4 specification. Two

versions with different capacitor values are available.

Cellular phone application frequently demands filtering

of signals in the 800 to 2,700 MHz band. California

Micro Devices’ unique thin film Flip Chip filters provide a

minimum of –30 dB of attenuation over this frequency

Applications

• EMI filter for Mobile Equipment

(e.g. Cellular Phones)

• Evaluation Device

C1460800

SCHEMATIC DIAGRAM

band. The bump size and pitch of these filters are

selected such that the device can be placed directly on

a FR4 printed circuit board using conventional assembly

techniques. Ground-bounce and cross-talk are mini-

mized by a die design that provides eight solder bump

contacts to the common supply connection. The solder

bump contacts are a 63/37 Sn/Pb alloy and are nomi-

nally 0.30 mm in diameter.

R 50

Ω

C

GND

R 50

Ω

R 90

Ω

C

GND

R 90

Ω

R 70

Ω

C

GND

R 70

Ω

R 50

Ω

C

GND

R 90

Ω

C

GND

R 70

Ω

C

GND

GND

C1

D1

D2

D3

D4

D5

B1

A1

A2

A3

A4

A5

C3

B3

C2

B2

C5

B5

C4 B4

GND

GND

GND

GND

GND

GND