30

80

130

180

0

0.5

1.5

COPPER AREA (sq. in.)

1

LP3882

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SNVS226F – MARCH 2003 – REVISED APRIL 2013

HEATSINKING PSOP PACKAGE

Heatsinking for the SO PowerPad package is accomplished by allowing heat to flow through the ground slug on

the bottom of the package into the copper on the PC board. The heat slug must be soldered down to a copper

plane to get good heat transfer. It can also be connected through vias to internal copper planes. Since the heat

slug is at ground potential, traces must not be routed under it which are not at ground potential. Under all

possible conditions, the junction temperature must be within the range specified under operating conditions.

Figure 23 shows a curve for the

with one ounce copper in still air.

Figure 23.

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