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Figure 17. Mounting the PowerSO package.

Figure 18. PowerSO20 Junction-Ambient thermal resistance versus on-board copper area.

Figure 19. PowerDIP20 Junction-Ambient thermal resistance versus on-board copper area.

Figure 20. SO20 Junction-Ambient thermal resistance versus on-board copper area.

Slug soldered

to PCB with

dissipating area

Slug soldered

to PCB with

dissipating area

plus ground layer

Slug soldered to PCB with

dissipating area plus ground layer

contacted through via holes

13

18

23

28

33

38

43

12

3

4

56

7

8

9

10

1 1

1 2

13

W ithout G round La yer

W ith Gr ound La yer

W ith Gr ound La yer + 16 via

Ho le s

sq . c m

ºC / W

On-Board Copper Area

s q . cm

ºC / W

On-Board Copper Area

Copper Area is on Bottom Side

Copper Area is on Top Side

33

34

35

36

37

38

39

40

41

42

12

34

56

7

8

9

10

11

12

48

50

52

54

56

58

60

62

64

66

68

123

45

6789

10

11

12

C o pp er A rea is o n T op S ide

sq. cm

ºC / W

On-Board Copper Area