Application Note

Sep 2008

7

Order Number: 320005-04

Conversion Guide: P33 130nm to 65nm

3.0

Device Packaging and Ballout

The following section provides a brief overview of the package and ballout differences

between the P33 130nm and P33 65nm devices.

Note:

For 256M/256M stack TSOP migration options, please contact your local Numonyx local Sales representative.

3.1

Easy BGA Ballout

The Easy BGA ballout is available for both P33 130nm and P33 65nm products. Ball

pitch of the Easy BGA ballout is 1.0 mm. The package has an 8 x 8 active-ball matrix.

Table 2:

Package Comparison

Features / Specifications

P33 130nm

P33 65nm

Monolithic Densities

Easy BGA

Yes

Yes

TSOP

Yes

Yes

QUAD+ (SCSP)

Yes

No

Stack Densities

Easy BGA

Yes

Yes

TSOP

Yes

See Note

QUAD+ (SCSP)

Yes

No

Figure 1: 64-Ball Easy BGA Ballout (256/512-Mbit)

1

8

234

5

67

Easy BGA

Top View- Ball side down

Easy BGA

Bottom View- Ball side up

1

8

2

3

4

5

6

7

H

G

F

E

D

C

B

A

H

G

F

E

D

C

A

A2

VSS

A9

A14

CE#

A19 RFU

A25

RFU

VSS VCC

DQ13

VSS

DQ7

A24

VSS

A3

A7

A10

A15

A12

A20

A21

WP#

A4

A5

A11

VCCQ

RST#

A16

A17

VCCQ

RFU

DQ8

DQ1 DQ9

DQ4

DQ3

DQ15

CLK

RFU

OE#

DQ0 DQ10

DQ12

DQ11

WAIT

ADV#

WE#

A23

RFU

DQ2

DQ5

VCCQ

DQ14

DQ6

A1

A6

A8

A13

VPP

A18

A22

VCC

A23

A4

A5

A11

VCCQ RST#

A16

A17

VCCQ

A1

A6

A8

A13

VPP

A18

A22

VCC

A3

A7

A10

A15

A12

A20

A21

WP#

RFU

DQ8

DQ1

DQ9

DQ4 DQ3

DQ15 CLK

RFU

OE#

DQ0

DQ10

DQ12 DQ11

WAIT ADV#

WE#

RFU

DQ2

DQ5 VCCQ

DQ14 DQ6

A2

VSS

A9

A14

CE#

A19

RFU

A25

RFU

VSS

VCC

DQ13 VSS

DQ7

A24

VSS

B