CS2516 datasheet(6/6 Pages) CHERRY

6 / 6 page

Part Number

Description

CS2516KN8

8 Lead PDIP

CS2516KD8

8 Lead SOIC

CS2516KDR8

8 Lead SOIC (tape & reel)

Lead Count

Metric

English

Max

Min

Max

Min

8L PDIP

10.16

9.02

.400

.355

8L SOIC

5.00

4.80

.197

.189

Thermal Data

8L PDIP

8L SO

QJC

typ

ûC/W

QJA

typ

100

165

ûC/W

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

Ordering Information

PACKAGE THERMAL DATA

Rev. 1/17/95

Cherry Semiconductor Corporation reserves the

right to make changes to the specifications without

notice. Please contact Cherry Semiconductor

Corporation for the latest available information.

1.27 (.050) BSC

0.51 (.020)

0.33 (.013)

6.20 (.244)

5.80 (.228)

4.00 (.157)

3.80 (.150)

1.57 (.062)

1.37 (.054)

0.25 (0.10)

0.10 (.004)

1.75 (.069) MAX

1.27 (.050)

0.40 (.016)

REF: JEDEC MS-012

0.25 (.010)

0.19 (.008)

Surface Mount Narrow Body (D); 150 mil wide

Plastic DIP (N); 300 mil wide

0.39 (.015)

MIN.

2.54 (.100) BSC

1.77 (.070)

1.14 (.045)

Some 8 and 16 lead

packages may have

1/2 lead at the end

of the package.

All specs are the same.

.203 (.008)

.356 (.014)

REF: JEDEC MS-001

3.68 (.145)

2.92 (.115)

8.26 (.325)

7.62 (.300)

7.11 (.280)

6.10 (.240)

.356 (.014)

.558 (.022)

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