Surface Mount Multilayer Varistor

5 / 8

@SOCAY Electronics Co., Ltd. 2013

Specifications are subject to change without notice.

Please refer to www.socay.com for current information.

SC0805ML - SC2220ML Series

SOCAY Electronics Co., Ltd.

www.socay.com

Length (L)

Width (W)

Thickness (T)

Size EIA

(EIAJ)

Inches

Millimeters

Inches

Millimeters

Inches

Millimeters

0805

(2012)

0.079

±0.008

2.00

±0.20

0.049

±0.006

1.25

±0.15

0.047 Max

1.20 Max

1206

(3216)

0.126

±0.008

3.20

±0.20

0.063

±0.006

1.60

±0.15

0.059 Max

1.50 Max

1210

(3225)

0.126

±0.008

3.20

±0.20

0.098

±0.008

2.50

±0.20

0.059 Max

1.50 Max

1812

(4532)

0.177

±0.008

4.50

±0.20

0.126

±0.008

3.20

±0.20

0.079 Max

2.00 Max

2220

(5750)

0.224

±0.008

5.70

±0.20

0.197

±0.008

5.00

±0.20

0.098 Max

2.50 Max

A

B

C

D

Size EIA

(EIAJ)

Inches

Millimeters

Inches

Millimeters

Inches

Millimeters

Inches

Millimeters

0805 (2012)

0.039~0.059

1.0~1.5

0.126~0.150

3.2~3.8

0.047~0.055

1.2~1.4

0.012~0.024

0.3~0.6

1206 (3216)

0.071~0.098

1.8~2.5

0.165~0.228

4.2~5.8

0.047~0.063

1.2~1.6

0.016~0.032

0.4~0.8

1210 (3225)

0.071~0.098

1.8~2.5

0.165~0.228

4.2~5.8

0.071~0.098

1.8~2.5

0.020~0.040

0.5~1.0

1812 (4532)

0.098~0.138

2.5~3.5

0.217~0.240

5.5~6.1

0.091~0.126

2.3~3.2

0.024~0.043

0.6~1.1

2220 (5750)

0.138~0.181

3.5~4.6

0.236~0.283

6.0~7.2

0.189~0.217

4.8~5.5

0.047~0.090

1.2~2.3

l The solder paste shall be printed in a thickness of 150 to 200

μm.

l The SIR test of the solder paste shall be done (Base on JIS-Z-3284)

l IR Soldering

Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling

process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure

that the element is not subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal

gradient. During the soldering process, pre-heating to within 100 degrees of the solder peak temperature is essential to

minimize thermal shock.

Dimensions

L

T

W

Soldering Recommendations

Avoid material run this area