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LTC3618 데이터시트(PDF) 21 Page - Linear Integrated Systems |
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LTC3618 데이터시트(HTML) 21 Page - Linear Integrated Systems |
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21 / 24 page ![]() LTC3618 21 3618fb FE Package 24-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1771 Rev B) Exposed Pad Variation AA FE24 (AA) TSSOP REV B 0910 0.09 – 0.20 (.0035 – .0079) 0 – 8 0.25 REF RECOMMENDED SOLDER PAD LAYOUT 0.50 – 0.75 (.020 – .030) 4.30 – 4.50* (.169 – .177) 13 4 5 6 7 8 9 10 11 12 14 13 7.70 – 7.90* (.303 – .311) 3.25 (.128) 2.74 (.108) 20 21 22 23 24 19 18 17 16 15 1.20 (.047) MAX 0.05 – 0.15 (.002 – .006) 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 2 2.74 (.108) 0.45 0.05 0.65 BSC 4.50 0.10 6.60 0.10 1.05 0.10 3.25 (.128) MILLIMETERS (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE SEE NOTE 4 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT 6.40 (.252) BSC PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. |
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