5

IXDD509 / IXDE509

IXYS reserves the right to change limits, test conditions, and dimensions.

Pin Description

CAUTION: Follow proper ESD procedures when handling and assembling this component.

PIN

SYMBOL

FUNCTION

DESCRIPTION

1,8

Supply Voltage

Power supply input voltage. These pins provide power to

the entire device. The range for this voltage is from 4.5V to

30V.

2

IN

Input

Input signal-TTL or CMOS compatible.

3

EN

Enable

The device ENABLE pin. This pin, when driven low,

disables the chip, forcing a high impedance state at the

output. EN can be pulled high by a resistor.

6,7

OUT

Output

Driver Output. For application purposes, these pins are

connected, through a resistor, to Gate of a MOSFET/IGBT.

4,8

GND

Ground

The device ground pins. Internally connected to all circuitry,

these pins provide ground reference for the entire chip and

should be connected to a low noise analog ground plane for

optimum performance.

Figure 3 - Characteristics Test Diagram

PIN CONFIGURATIONS

NOTE: Solder tabs on bottoms of DFN packages are grounded

8 PIN DIP (PI)

8 PIN SOIC (SIA)

VCC

IN

EN

GND

VCC

OUT

OUT

1

2

3

4

8

7

6

5

I

X

D

E

5

0

9

GND

8 PIN DIP (PI)

8 PIN SOIC (SIA)

VCC

IN

EN

GND

VCC

OUT

OUT

1

2

3

4

8

7

6

I

X

D

D

5

0

9

GND

6 LEAD DFN (D1)

(Bottom View)

IN

EN

GND

VCC

GND

OUT

1

2

3

6

5

4

I

X

D

D

5

0

9

6 LEAD DFN (D1)

(Bottom View)

IN

EN

GND

VCC

GND

OUT

1

2

3

6

5

4

I

X

D

E

5

0

9

5

0V

5V

C

LOAD

Agilent 1147A

Current Probe

1

2

3

4

5

6

7

8

10uf

0.01uf

Vcc

0V

Vcc

0V

Vcc

IXDD

IXDE