Product Specification

SP4273

Page 4 of 10

Evaluation Kit

The SPDT Switch Evaluation Kit board was

designed to ease customer evaluation of the

SP4273 SPDT switch. The RF common port is

connected through a 75

Ω transmission line to the

bottom F connector, J2. Port 1 and Port 2 are

connected through 75

Ω transmission lines to two F

connectors on either side of the board, J3 and J1. A

through transmission line connects F connectors J4

and J5. This transmission line can be used to

estimate the loss of the PCB over the environmental

conditions being evaluated.

The board is constructed of a two metal layer FR4

material with a total thickness of 0.031”. The bottom

layer provides ground for the RF transmission lines.

The transmission lines were designed using a

coplanar waveguide with ground plane model using

a trace width of 0.021”, trace gaps of 0.030”,

dielectric thickness of 0.028”, copper thickness of

0.0021” and

ε

J6 and J7 provide a means for controlling the DC

inputs to the device. The lower left header (J6) is

connected to the device V1 input. The lower right

header (J7) is connected to the device V2 input.

Series resistors (R1 and R2) are provided to reduce

the package resonance between RF and DC lines.

Footprints for decoupling capacitors (100 pF) are

provided on both V1 and V2 traces. It is the

responsibility of the customer to determine proper

supply decoupling for their design application.

Removing these components from the evaluation

board has not been shown to degrade RF

performance.

Figure 5. Evaluation Board Layouts

Figure 6. Evaluation Board Schematic

Tel: +86-23-62808818

Fax: +86-23-62805284

www.sipatsaw.com / sawmkt@sipat.com