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LM3555 데이터시트(PDF) 4 Page - Texas Instruments |
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LM3555 데이터시트(HTML) 4 Page - Texas Instruments |
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4 / 33 page ![]() LM3555 SNVS594E – JANUARY 2009 – REVISED NOVEMBER 2011 www.ti.com Thermal Properties Thermal Resistance Junction-to-Ambient ( θJA) (1) 60°C/W (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm/18µm/3µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. 4 Submit Documentation Feedback Copyright © 2009–2011, Texas Instruments Incorporated Product Folder Links: LM3555 |
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