ZXTR2012K datasheet(2/7 Pages) DIODES

2 / 7 page

ZXTR2012K

Document number: DS36327 Rev. 1 – 2

2 of 7

www.diodes.com

December 2013

ZXTR2012K

A Product Line of

Diodes Incorporated

Absolute Maximum Ratings (Voltage relative to GND, @TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Input Supply Voltage

VIN

-0.3 to 100

Continuous Input & Output Current

IIN, IOUT

750

Peak Pulsed Input & Output Current

IIM, IOM

Maximum Voltage applied to VOUT

VOUT(max)

Maximum Current at VIN = 48V (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Continuous Output Current

(Note 7)

IOUT

Pulsed Output Current

(Note 8)

IOM

960

(Note 9)

200

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 5)

2.3

(Note 6)

1.1

Thermal Resistance, Junction to Ambient

(Note 5)

RθJA

°C/W



(Note 6)

Thermal Resistance, Junction to Lead

(Note 10)

RθJL

8.4

Thermal Resistance, Junction to Case

(Note 10)

RθJC

14.6

Recommended Operating Junction Temperature Range

-40 to +125

°C

Maximum Operating Junction and Storage Temperature Range

TJ , TSTG

-65 to +150

ESD Ratings (Note 11)

Characteristics

Symbols

Value

Unit

JEDEC Class

Electrostatic Discharge – Human Body Model

ESD HBM

4000

Electrostatic Discharge – Machine Model

ESD MM

400

Notes:

5. For a device mounted with the exposed VIN pad on 50mm x 50mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still

air conditions whilst operating in steady-state.

6. Same as note 5, except mounted on 15mm x 15mm 1oz copper.

7. Same as note 5, whilst operating at VIN = 48V. Refer to Safe Operating Area for other Input Voltages.

8. Same as note 5, except measured with a single pulse width = 100µs and VIN = 48V.

9. Same as note 5, except measured with a single pulse width = 10ms and VIN = 48V.

10.

RθJL = Thermal resistance from junction to solder-point (on the exposed VIN pad).

RθJC = Thermal resistance from junction to the top of case.

11. Refer to JEDEC specification JESD22-A114 and JESD22-A115

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