LM27341_14 datasheet(3/42 Pages) TI1

3 / 42 page

LM27341, LM27342, LM27341Q, LM27342Q

www.ti.com

SNVS497D – NOVEMBER 2008 – REVISED FEBRUARY 2010

Absolute Maximum Ratings

(1) (2)

AVIN, PVIN

-0.5V to 24V

SW Voltage

-0.5V to 24V

Boost Voltage

-0.5V to 28V

Boost to SW Voltage

-0.5V to 6.0V

FB Voltage

-0.5V to 3.0V

SYNC Voltage

-0.5V to 6.0V

EN Voltage

-0.5V to (VIN + 0.3V)

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

ESD Susceptibility(3)

2kV

Soldering Information

Infrared Reflow (5sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings

indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human body model, 1.5 k

Ω in series with 100 pF.

Operating Ratings

(1)

AVIN, PVIN

3V to 20V

SW Voltage

-0.5V to 20V

Boost Voltage

-0.5V to 24V

Boost to SW Voltage

3.0V to 5.5V

Junction Temperature Range

−40°C to +125°C

Thermal Resistance (

θJA) SON

(2)

33°C/W

Thermal Resistance (

θJA) MSOP-PowerPad

(2)

45°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the recommended Operating Ratings is not implied. The recommended Operating Ratings

indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2)

Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA

and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for

packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.

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