SW

1

RON

2

VIN

3

BOOT

4

VCC

8

GND

7

DIM

6

CS

5

SW

1

RON

2

VIN

3

BOOT

4

VCC

8

GND

7

DIM

6

CS

5

DAP

LM3402, LM3402HV

SNVS450D – SEPTEMBER 2006 – REVISED FEBRUARY 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Connection Diagram

Figure 1. 8-Lead Plastic VSSOP-8 Package

Figure 2. 8-Lead Plastic SO PowerPAD-8 Package

See Package Number DGK (S-PDSO-G8)

See Package Number DDA0008B

PIN DESCRIPTIONS

Pin(s)

Name

Description

Application Information

1

SW

Switch pin

Connect this pin to the output inductor and Schottky diode.

2

BOOT

MOSFET drive bootstrap pin

Connect a 10 nF ceramic capacitor from this pin to SW.

3

DIM

Input for PWM dimming

Connect a logic-level PWM signal to this pin to enable/disable the power FET and

reduce the average light output of the LED array.

4

GND

Ground pin

Connect this pin to system ground.

5

CS

Current sense feedback pin

Set the current through the LED array by connecting a resistor from this pin to

ground.

6

RON

On-time control pin

A resistor connected from this pin to VIN sets the regulator controlled on-time.

7

VCC

Output of the internal 7V linear

Bypass this pin to ground with a minimum 0.1 µF ceramic capacitor with X5R or

regulator

X7R dielectric.

8

VIN

Input voltage pin

Nominal operating input range is 6V to 42V (LM3402) or 6V to 75V (LM3402HV).

DAP

GND

Thermal Pad

Connect to ground. Place 4 to 6 vias from DAP to bottom layer ground plane.

ABSOLUTE MAXIMUM RATINGS(LM3402)

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors

for availability and specifications.

VALUE / UNIT

VIN to GND

–0.3V to 45V

BOOT to GND

–0.3V to 59V

SW to GND

–1.5V

BOOT to VCC

–0.3V to 45V

BOOT to SW

–0.3V to 14V

VCC to GND

–0.3V to 14V

DIM to GND

–0.3V to 7V

CS to GND

–0.3V to 7V

RON to GND

–0.3V to 7V

Junction Temperature

150°C

Storage Temp. Range

–65°C to 125°C

2kV

Soldering Information

Lead Temperature (Soldering, 10sec)

260°C

Infrared/Convection Reflow (15sec)

235°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see Electrical Characteristics.

(2)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin.

2

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