DocID022065 Rev 3

5/12

SM30TY

Characteristics

12

Figure 11. Thermal resistance junction to ambient versus copper surface under each

lead

Figure 9. Peak forward voltage drop versus

peak forward current

(typical values)

Figure 10. Relative variation of thermal

impedance, junction to ambient, versus pulse

duration

I(A)

FM

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

T = 150 °C

j

T = 25 °C

j

V(V)

FM

Z/R

th(j-a)

th(j-a)

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Recommended pad layout

Single pulse

t (s)

p

epoxy printed board, FR4 copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S (cm )

Cu

2

epoxy printed board, FR4 copper thickness = 35 µm