Top View

A1

A2

B1

B2

B3

Top View

A3

C2

C1

C3

D2

D3

A4

B4

C4

D4

D1

Pin 1A

LM3556

SNVS796C – AUGUST 2011 – REVISED APRIL 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

CONNECTION DIAGRAM

Figure 1. 16-Bump DSBGA Package YFQ16ACA

PIN DESCRIPTIONS

Pin

Name

Description

High-Side Current Source Output for Flash LED. Both bumps must be connected for proper

A1, B1

LED

operation.

Step-Up DC/DC Converter Output. Connect a 10 µF ceramic capacitor between this pin and

B2, A2

OUT

GND.

B3, A3

SW

Drain Connection for Internal NMOS and Synchronous PMOS Switches.

A4, B4

GND

Ground

C1

TEMP

Threshold Detector for LED Temperature Sensing and Current Scale Back.

Active High Hardware Torch Enable. Drive TORCH high to turn on Torch/Movie Mode. Used

C2

TORCH

for External PWM mode. Has an internal pulldown resistor of 300 k

Ω between TORCH and

GND.

Active High Hardware Flash Enable. Drive STROBE high to turn on Flash pulse. STROBE

C3

STROBE

overrides TORCH. Has an internal pulldown resistor of 300 k

Ω between STROBE and GND.

Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a 10 µF or

C4

IN

larger ceramic capacitor.

Configurable Dual Polarity Power Amplifier Synchronization Input. Has an internal pulldown

D1

TX

resistor of 300 k

Ω between TX and GND.

D2

SDA

Serial Data Input/Output.

D3

SCL

Serial Clock Input.

Active High Enable Pin. High = Standby, Low = Shutdown/Reset. There is no internal

D4

ENABLE

pulldown resistor on this pin.

2

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