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GI1002 데이터시트(PDF) 1 Page - General Semiconductor |
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GI1002 데이터시트(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() GI1001 THRU GI1004 GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Hermetically sealed package ♦ Low leakage current ♦ High surge capability ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS GI1001 GI1002 GI1003 GI1004 UNITS Maximum repetitive peak reverse voltage VRRM 50 100 150 200 Volts Maximum RMS voltage VRMS 35 70 105 140 Volts Maximum DC blocking voltage VDC 50 100 150 200 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=75°C I(AV) 1.0 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TL=75 °C IFSM 30.0 Amps Maximum instantaneous forward voltage at 1.0A VF 0.975 Volts Maximum DC reverse current TA=25°C 2.0 at rated DC blocking voltage TA=100°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 25.0 ns Typical junction capacitance (NOTE 2) CJ 45.0 pF Typical thermal resistance (NOTE 3) R ΘJA 65.0 (NOTE 4) R ΘJL 20.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5” (12 x 12mm) (4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heatsinks 4/98 0.034 (0.86) 0.028 (0.71) DIA. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 1.0 (25.4) MIN. DO-204AP Dimensions in inches and (millimeters) *Brazed lead assembly is covered by Patent No. 3,930,30 |
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