| 전자부품 데이터시트 검색엔진 |
|
TSL1401CS 데이터시트(PDF) 16 Page - ams AG |
|
|
|||||||||||||||||||||||||||||
TSL1401CS 데이터시트(HTML) 16 Page - ams AG |
|
16 / 19 page ![]() TSL1401CS−LF 128 × 1 LINEAR SENSOR ARRAY WITH HOLD TAOS072E − APRIL 2007 15 The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com MANUFACTURING INFORMATION t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 14. TSL1401CS−LF Solder Bump Linear Array Package Solder Profile It is important to use a substrate that has an immersion plating surface. This may be immersion gold, silver, or white tin. Hot air solder leveled substrates (HASL) are not coplanar and should not be used. Qualified Equipment D EKRA E5 — Stencil Printer D ASYMTEC Century — Dispensing system D SIEMENS F5 — Placement system − SIEMENS 912 — Vacuum Pickup Tool Nozzle D VITRONICS 820 — Oven D PHOENIX — Inspector X-Ray system Qualified Materials D OMG — Microbond solder paste D Loctite 3621 — Adhesive |
|
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |