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ML22Q563 데이터시트(PDF) 63 Page - List of Unclassifed Manufacturers

부품명 ML22Q563
상세설명  4-Channel Mixing Speech Synthesis LSI
PDF  66 Pages
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제조업체  ETC2 [List of Unclassifed Manufacturers]
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ML22Q563 데이터시트(HTML) 63 Page - List of Unclassifed Manufacturers

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FEDL2257X-05
ML22Q573/ML2257X
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
Notes for heat sink type Package
This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land
pattern corresponding to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the
LSI solder open or GND on the board. Be sure to refer to the next clause reference data ( Mounting area for
package lead soldering to PC boards ).
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