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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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DIM500GDM33-TS000 데이터시트(PDF) 7 Page - Dynex Semiconductor |
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DIM500GDM33-TS000 데이터시트(HTML) 7 Page - Dynex Semiconductor |
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7 / 8 page  DIM500GDM33-TS000 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures 7/8 www.dynexsemi.com PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Nominal Weight: 1000g Module Outline Type Code: G Fig. 11 Module outline drawing 0.5 57 ±0.25 57 ±0.25 25.5 ±0.2 29.5 ±0.2 43 ±0.2 47 ±0.2 45 ±0.2 29.5 ±0.2 55.2 ±0.3 11.85 ±0.2 29.5 ± 0.5 28.2 ±0.5 4 x M8 6 x M4 screwing depth max 16 screwing depth max 8 6 x 7 Ø 130 ± |
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