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Selection Guide–Package Styles and Lead Configuration Options

Package

8 Pin DIP

8 Pin DIP

20 Pad LCCC

Lead Style

Through Hole

Through Hole

Surface Mount

Channels

1

2

2

Common Channel

None

None

Wiring

HP Part # & Options

Commercial

HCPL-5400

HCPL-5430

HCPL-6430

MIL-PRF-38534, Class H

HCPL-5401

HCPL-5431

HCPL-6431

MIL-PRF-38534, Class K

HCPL-540K

HCPL-543K

HCPL-643K

Standard Lead Finish

Gold Plate

Gold Plate

Solder Pads

Solder Dipped

Option #200

Option #200

Butt Cut/Gold Plate

Option #100

Option #100

Gull Wing/Soldered

Option #300

Option #300

SMD Part #

Prescript for all below

5962-

5962-

5962-

Either Gold or Solder

8957001PX

8957101PX

89571022X

Gold Plate

8957001PC

8957101PC

Solder Dipped

8957001PA

8957101PA

89571022A

Butt Cut/Gold Plate

8957001YC

8957101YC

Butt Cut/Soldered

8957001YA

8957101YA

Gull Wing/Soldered

8957001XA

8957101XA

data rate capability. The detector

has a threshold with hysteresis,

which typically provides 0.25 mA

of differential mode noise

immunity and minimizes the

potential for output signal

chatter. The detector in the single

channel units has a three state

output stage which eliminates the

need for a pull-up resistor and

allows for direct drive of a data

bus.

All units are compatible with TTL,

STTL, LSTTL, and HCMOS logic

families. The 35 ns pulse width

distortion specification guaran-

tees a 10 MBd signaling rate at

+125

°C with 35% pulse width

distortion. Figures 13 through 16

show recommended circuits for

reducing pulse width distortion

and optimizing the signal rate of

the product. Package styles for

these parts are 8 pin DIP through

hole (case outlines P), and

leadless ceramic chip carrier

(case outline 2). Devices may be

purchased with a variety of lead

bend and plating options. See

Selection Guide Table for details.

Standard Military Drawing (SMD)

parts are available for each

package and lead style.

Because the same electrical die

(emitters and detectors) are used

for each channel of each device

listed in this data sheet, absolute

maximum ratings, recommended

operating conditions, electrical

specifications, and performance

characteristics shown in the

figures are similar for all parts.

Occasional exceptions exist due

to package variations and limita-

tions and are as noted. Addition-

ally, the same package assembly

processes and materials are used

in all devices. These similarities

give justification for the use of

data obtained from one part to

represent other part’s perform-

ance for die related reliability and

certain limited radiation test

results.