SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0083, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF4080CT

MBRF4090CT

MBRF40100CT

Electrical Characteristics:

Characteristics

Symbol

Condition

Typ.

Max.

Units

Forward Voltage Drop*

°C

0.72

0.79

0.88

0.80

0.88

1.02

V

0.63

0.70

0.80

0.70

0.74

0.88

V

Reverse Current (per leg)*

0.006

1.0

mA

°C

0.09

6

mA

Junction Capacitance

(per leg)

363

400

pF

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm

from package body

-

8.0

nH

Voltage Rate of Change

dv/dt

-

-

10,000

V/

µs

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

-

4500

Clip mounting, the epoxy body is

inside the heatsink.

-

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

Screw mounting, the epoxy body

is inside the heatsink.

-

1500

V

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-

-55 to +150

°C

Max. Storage Temperature

-

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

(per leg)

DC operation

3.5

°C/W

Approximate Weight

wt

-

2

g

Case Style

ITO-220AB