7

PS8701

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

• Peak reflow temperature

235 °C (package surface temperature)

• Time of temperature higher than 210 °C

30 seconds or less

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt % is recommended.)

60 to 90 s

(preheating)

210 ˚C

120 to 160 ˚C

Time (s)

(heating)

to 10 s

to 30 s

235 ˚C (peak temperature)

Recommended Temperature Profile of Infrared Reflow

Peak temperature 235 ˚C or below

(2) Dip soldering

• Temperature

260 °C or below (molten solder temperature)

• Time

10 seconds or less

• Number of times

One

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of

0.2 Wt % is recommended.)