MSF2N40 datasheet(2/6 Pages) BWTECH

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MSF2N40

400V N-Channel MOSFET

Publication Order Number: [MSF2N40]

Absolute Maximum Ratings

Symbol

Parameter

Value

Unit

Maximum lead temperature for soldering purposes,

1/8'' from case for 5 seconds

300

°C

TPKG

Maximum Temperature for Soldering @ Package Body for 10

seconds

260

°C

Total Power Dissipation(@TC = 25 °C) 44 W

Derating Factor above 25 °C

0.3

W/°C

TSTG

Operating and Storage Temperature Range

-55 to +150

°C

Storage Temperature

150

°C

Note:

1. Repetitive rating; pulse width limited by maximum junction temperature.

2. IAS=5.5A, VDD=50V, L=8mH, VG=10V, starting TJ=+25°C.

3. ISD≤5.5A, dI/dt≤100A/μs, VDD≤BVDSS, starting TJ=+25°C.

Thermal characteristics (Tc=25°C unless otherwise noted)

Symbol

Parameter

Max.

Units

Rthjc

Typical thermal resistance

2.87

°C/W

RθJA

Typical thermal resistance

62.5

* When mounted on the minimum pad size recommended (PCB Mount)

Static Characteristics

Symbol

Test Conditions

Min

Typ.

Max.

Units

VGS

VDS = VGS,ID = 250μA

2.0

4.0

*RDS(ON)

VGS = 10 V,ID = 1.0 A

1.0

1.5

BVDSS

VGS = 0 V , ID = 250μA

400

△BV

DSS /△TJ

ID = 250μA, Referenced to 25°C

0.4

IDSS

VDS = 400 V , VGS = 0 V

VDS = 320 V , VGS = 0 V , TC= 125°C

μA

IGSSF

VGS = 30 V , VDS = 0 V

100

IGSSR

VGS = -30 V , VDS = 0 V

-100

Dynamic Characteristics

Symbol

Test Conditions

Min

Typ.

Max.

Units

CISS

VDS = 25 V, VGS = 0 V,

f = 1.0MHz

670

870

COSS

125

CRSS

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