7

Chip Dimensions and Pad Layout

Dimensions in parenthesis are in millimeters and are derived

from the basic inch dimensions as indicated. Grid

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches

FIGURE 8. TYPICAL POWER DISSIPATION vs FREQUENCY

CHARACTERISTICS

FIGURE 9. TYPICAL POWER DISSIPATION vs INPUT RISE

AND FALL TIMES PER INVERTER

5V

10V

8

6

4

28

6

4

22

INPUT FREQUENCY (f) (kHz)

8

6

4

28

6

4

8

6

4

2

8

6

4

2

8

6

4

2

8

6

4

2

10

SUPPLY VOLTAGE

(VDD) = 15V

10

CL = 15pF (11pF FIXTURE + 4pF EXT

LOAD CAPACITANCE (CL) = 50pF

10V

(11pF FIXTURE + 39pF EXT)

INPUT RISE AND FALL TIME (tr, tf) (ns)

10

1

10

SUPPLY VOLTAGE (VCC) = 5V

FREQUENCY (f) = 10KHz

15V; 1KHz

15V; 100KHz

15V; 1MHz

10V; 100KHz

15V; 10KHz

10V; 10KHz

CD4049UBMS