DG303ABK datasheet(3/7 Pages) INTERSIL

3 / 7 page

4-3

Absolute Maximum Ratings

Thermal Information

V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V

V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V

Digital Inputs, VS, VD (Note 1) . . . . . . . . . . . . . (V-) - 2V to (V+) + 2V

or 30mA, Whichever Occurs First

Continuous Current, (Any Terminal). . . . . . . . . . . . . . . . . . . . . 30mA

Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100mA

Operating Conditions

Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±15V

Temperature Range

“A” Sufﬁx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC

“B” Sufﬁx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25oC to 85oC

“C” Sufﬁx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC

Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)

Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V (Min)

Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . .

≤20ns

Thermal Resistance (Typical, Note 2)

θJA (oC/W) θJC (oC/W)

SOIC Package . . . . . . . . . . . . . . . . . . .

100

N/A

PDIP Package . . . . . . . . . . . . . . . . . . .

100

N/A

CERDIP Package . . . . . . . . . . . . . . . . .

Maximum Junction Temperature

Hermetic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175oC

Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC

Maximum Lead Temperature (Soldering, 10s). . . . . . . . . . . . 300oC

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

1. Signals on SX, DX or INX exceeding V+ or V- will be clamped by internal diodes. Limit diode forward current to maximum current ratings.

θJA is measured with the component mounted on an evaluation PC board in free air.

Electrical Speciﬁcations

V+ = +15V, V- = -15V, GND = 0V, TA = 25

PARAMETER

TEST CONDITIONS

“A” SUFFIX

“B” AND “C” SUFFIX

UNITS

MIN

(NOTE 3)

TYP

MAX

MIN

(NOTE 3)

TYP

MAX

DYNAMIC CHARACTERISTICS

Turn-ON Time, tON

See Figure 3

150

300

150

Turn-OFF Time, tOFF

See Figure 3

130

250

130

Break-Before-Make

Interval, tD

See Figure 2, DG301A/DG303A

Charge Injection, Q

CL = 10nF, RS = 0, VS = 0

-3-

OFF Isolation (Note 4)

VIN = 0, RL = 1kΩ, VS = 1VRMS,

f = 500kHz

-62--62-

Crosstalk

(Channel-to-Channel)

-74

Source OFF Capacitance,

CS(OFF)

f = 1MHz,

VIN = 0.8V or

VIN = 4.0V

VS = 0

Drain OFF Capacitance,

CD(OFF)

VD = 0

Channel ON Capacitance,

CD(ON) + CS(ON)

VS = VD = 0

Input Capacitance, CIN

f = 1MHz

VIN = 0

-6-

VIN = 15V

DIGITAL INPUT CHARACTERISTICS

Input Current with Voltage

High, IIH

VIN = 5.0V

-1

-0.001

-1

-0.001

µA

VIN = 15.0V

0.001

µA

Input Current with Voltage

Low, IIL

VIN = 0V

-1

-0.001

-1

-0.001

µA

DG300A, DG301A, DG303A

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