AD8591/AD8592/AD8594

Rev. B | Page 16 of 16

16

9

8

1

PIN 1

SEATING

PLANE

8°

0°

4.50

4.40

4.30

6.40

BSC

5.10

5.00

4.90

0.65

BSC

0.15

0.05

1.20

MAX

0.20

0.09

0.75

0.60

0.45

0.30

0.19

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 47. 16-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8591ART-REEL

−40°C to +85°C

6-Lead SOT-23

RJ-6

A9A

AD8591ART-REEL7

−40°C to +85°C

6-Lead SOT-23

RJ-6

A9A

AD8591ARTZ-REEL1

−40°C to +85°C

6-Lead SOT-23

RJ-6

A9A#

AD8591ARTZ-REEL71

−40°C to +85°C

6-Lead SOT-23

RJ-6

A9A#

AD8592ARM-REEL

−40°C to +85°C

10-Lead MSOP

RM-10

AQA

AD8592ARMZ-REEL1

−40°C to +85°C

10-Lead MSOP

RM-10

AQA#

AD8594AR

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594AR-REEL

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594AR-REEL7

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594ARZ1

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594ARZ-REEL1

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594ARZ-REEL71

−40°C to +85°C

16-Lead SOIC_N

R-16

AD8594ARU-REEL

−40°C to +85°C

16-Lead TSSOP

RU-16

AD8594ARUZ-REEL1

−40°C to +85°C

16-Lead TSSOP

RU-16

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registered trademarks are the property of their respective owners.

D01106-0-1/09(B)