AD8603/AD8607/AD8609

Rev. C | Page 14 of 16

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH

THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.

PIN 1

1.60 BSC

2.80 BSC

1.90

BSC

0.95 BSC

0.20

0.08

0.60

0.45

0.30

8°

4°

0°

0.50

0.30

0.10 MAX

SEATING

PLANE

*1.00 MAX

*0.90

0.87

0.84

2.90 BSC

54

12

3

Figure 48. 5-Lead Thin Small Outline Transistor Package [TSOT]

(UJ-5)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-AA

0.80

0.60

0.40

8°

0°

4

8

1

5

PIN 1

0.65 BSC

SEATING

PLANE

0.38

0.22

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.08

3.20

3.00

2.80

5.15

4.90

4.65

0.15

0.00

0.95

0.85

0.75

Figure 49. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters