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HCS05MS

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100

µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCS05MS

Y1 (2)

A2 (3)

Y2 (4)

A3 (5)

(12) Y6

(11) A5

(10) Y5

(9) A4

Spec Number

518829