| 전자부품 데이터시트 검색엔진 |
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HCS08MS 데이터시트(PDF) 8 Page - Intersil Corporation |
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HCS08MS 데이터시트(HTML) 8 Page - Intersil Corporation |
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8 / 8 page ![]() 8 HCS08MS Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS08MS VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (12) A4 (11) Y4 (10) B3 (9) A3 (6) (7) (8) Y2 GND Y3 A1 (1) (14) (13) Spec Number 518746 |
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