| 전자부품 데이터시트 검색엔진 |
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HCS166D 데이터시트(PDF) 9 Page - Intersil Corporation |
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HCS166D 데이터시트(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 258 HCS166MS Die Characteristics DIE DIMENSIONS: 94 x 94 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS166MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS166 is TA14386A. DS (1) D0 D1 (3) (2) D2 (4) D3 (5) CE (6) (7) CP (8) GND (9) MR (10) D4 (11) D5 VCC (16) PE (15) (14) D7 (13) Q7 (12) D6 Spec Number 518758 |
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