 |
전자부품 데이터시트 검색엔진 |
|
|
전자부품 데이터시트 검색엔진 |
|
UPC1857ACT 데이터시트(PDF) 40 Page - NEC |
|
|
|||||||||||||||||||||||||||||
UPC1857ACT 데이터시트(HTML) 40 Page - NEC |
|
|
40 / 44 page  40 µµµµPC1857A 8. RECOMMENDED SOLDERING CONDITIONS It is recommended to solder this product under the conditions described below. For details of the recommended soldering conditions, refer to the Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, consult NEC. Soldering condition of through-hole type µµµµPC1857ACT: 30-pin plastic shrink DIP (400 mil) Soldering Method Soldering Condition Wave soldering (only pins) Soldering bath temperature: 260 °C MAX., Time: 10 seconds Partial heating Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per pin) Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact the package. |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
