HIP0081AS2 datasheet(10/15 Pages) INTERSIL

10 / 15 page

HIP0080, HIP0081The Junction-to-Ambient equivalent to

Equation 3, 3A is:

HIP0080, HIP0081or:

HIP0080, HIP0081Not all Integrated Circuit packages have

a directly definable case temperature because the heat is

spread thru the lead frame to a PC Board which is the

effective heat sink.

Calculation Example 1

HIP0080, HIP0081For the HIP0081,

JC = 3

oC/W and the

worst case junction temperature, as an application design

solution, should not exceed 150oC. For a given application,

Equation 1 determines the dissipation, PD.

HIP0080, HIP0081Assume the package is mounted to a

heat sink having a thermal resistance of 6oC/W and, for a

given application, assume the dissipation is 3W and the

ambient temperature (TA) is 100

oC. From Equation 4, θJA is

9oC/W. The solution for junction temperature (TC) by

Equation 3 is:

HIP0080, HIP0081TJ = 100

oC + 3W x 9oC/W = 127oC.

Calculation Example 2:

HIP0080, HIP0081Assume for the HIP0080,

JA = 30

oC/W

mounted on a PC Board with good heat sinking

characteristics. Again, the worst case junction temperature,

as an application design solution, should not exceed

150oC. Assume from the application, based on Equation 1,

the dissipation, PD = 1.5W. The maximum junction

temperature is known and can be used to determine the

maximum allowable ambient temperature from Equation 5A

as follows:

HIP0080, HIP0081TA = 150

oC - 1.5W x 30oC/W = 105oC.

Equal Current Loading Solution

HIP0080, HIP0081Many applications may have equal

current loading in the output drivers with equal saturated

turn ON and temperature conditions. As such, a convenient

method to show rating boundaries is to substitute the

dissipation Equation 2 into the junction temperature

Equation 3. For m outputs that are ON and conducting with

equal currents, where I = I1=I2.....=Im, we have the

following solution for dissipation:

HIP0080, HIP0081The number of output drivers ON and

conducting (m) may be from 1 to n. (i.e., For all four output

drivers of the HIP0081 ON, m = 4.) Maximum temperature,

dissipation and current ratings must be observed. For a

defined number of conducting Power MOS Output Drivers,

we can plot the results for m devices showing I vs TC.

HIP0080, HIP0081Given the HIP0081 as an example,

Figures 6 and Figure 7 illustrate the boundaries for

temperature and current. Figure 6 shows the maximum

current for a single output ON while Figure 7 shows the

maximum current for all four outputs ON with equal current

plotted versus Case Temperature, TC. Boundary conditions

relate to the Absolute Maximum Ratings as defined in the

Data Sheet.

(EQ. 5)

(EQ. 5A)

–

(EQ. 6)

DS ON

()

–

DS ON

()

--------------------------------------------------

(EQ. 7)

FIGURE 6. HIP0081 MAXIMUM SINGLE OUTPUT CURRENT vs CASE (TAB) TEMPERATURE

100

125

150

0.0

0.5

1.0

1.5

2.0

2.5

3.0

CASE (HEAT SINK TAB) TEMPERATURE (oC)

(1)

(2)

CURVE (1): rDS(ON) = 1Ω

CURVE (2): rDS(ON) = 0.5Ω

THERMAL RESISTANCE,

θJC = 3oC/W

MAX. +IOUT(DC)

HIP0080, HIP0081

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