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MASW011053 데이터시트(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

부품명 MASW011053
상세설명  HMIC Silicon PIN Diode SP3T Switch with Integrated Bias Network
PDF  6 Pages
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제조업체  MA-COM [M/A-COM Technology Solutions, Inc.]
홈페이지  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

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HMIC Silicon PIN Diode SP3T Switch with Integrated Bias Network
2 - 18 GHz
Rev. V1
MASW-011053
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
1
Features
 Broad Bandwidth Specified up to 18 GHz
 Usable up to 26 GHz
 Integrated Bias Network
 Low Insertion Loss / High Isolation
 Fully Monolithic
 Glass Encapsulate Construction
 RoHS Compliant* and 260°C Reflow Compatible
Description
The MASW-011053 device is a SP3T broad band
switch with integrated bias networks utilizing
MACOM’s patented HMIC (Heterolithic Microwave
Integrated Circuit) process. This process allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in low
loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and
glass gives HMIC devices low loss and high isolation
performance with exceptional repeatability through
low millimeter frequencies. Large bond pads
facilitate the use of low inductance ribbon bonds,
while gold backside metallization allows for manual
or automatic chip bonding via 80/20 - Au/Sn,
62/36/2 - Sn/Pb/Ag solders or electrically conductive
silver epoxy.
Pin Configuration2
Pin
Function
J1
Antenna
J2
RFIN
J3
RFIN
J4
RFIN
J5
Bias of J2
J6
Bias of J3
J7
Bias of J4
J8
Bias of Antenna
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
Ordering Information1
Part Number
Package
MASW-011053-47300G
Die in Gel Pack
MASW-011053-47300W
Die in Waffle Pack
1. Die quantity varies.
Functional Diagram
2. The exposed metallization on the chip bottom must be
connected to RF, DC and thermal ground.
J5
J6
L
C
SW1
SW2
J1
J4
J2
C
L
C
L
C
J8
J7
C
J3
SW3
C
C
L
C


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