| 전자부품 데이터시트 검색엔진 |
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ASA303A 데이터시트(PDF) 8 Page - Advanced Semiconductor Business Inc. |
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ASA303A 데이터시트(HTML) 8 Page - Advanced Semiconductor Business Inc. |
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8 / 9 page ![]() 8/9 ASB Inc. sales@asb.co.kr June 2014 ASA303A ㅇ version 1. 4. Package Outline (QFN24, 4.0x4.0x1.5 mm3) 5. Surface Mount Recommendation (In mm) Symbols Dimensions (In mm) MIN NOM MAX A 0.80 0.85 0.90 A1 0 0.010 0.030 A3 --- 0.20REF --- b 0.18 0.23 0.28 D 3.95 4.00 4.03 D1 --- 2.60BSC --- E 3.95 4.00 4.03 E1 --- 2.60BSC --- e --- 0.50BSC --- L 0.35 0.40 0.45 -12 --- 0 ccc --- 0.08 --- M --- --- 0.05 Burr 0 0.030 0.060 NOTE 1. The number and size of ground via holes in a circuit board is critical for thermal and RF grounding con- siderations. 2. Recommended is that the ground via holes be placed on the bottom of the exposed pad of the de- vice for better RF and thermal performance, as shown in the drawing at the left side. |
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