µPC8002

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11. RECOMMENDED SOLDERING CONDITIONS

The following conditions ( see table below) must be met when soldering this product.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY

MANUAL" (C10535E).

Please consult with our sales offices in case other soldering process or condition is used.

IR35-107-2

VP15-107-2

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions : 25 ˚C and relative humidity at 65 % or less.

Caution

Do not apply more than one soldering method at any one time, except for " Partial heating

method".

VPS

Peak package's surface temperature: 235 ˚C or below.

Reflow time : 30 seconds or below (210 ˚C or higher),

Number of reflow processes : MAX.2

(10 hours pre-baking is required at 125 ˚C afterwards)

Peak package's temperature: 215 ˚C or below.

Reflow time : 40 seconds or below (200 ˚C or higher),

Number of reflow processes : MAX. 2

(10 hours pre-baking is required at 125 ˚C afterwards)

Terminal temperature : 300 ˚C or below,

Time : 3 seconds or below (Per side of pin position)

TYPE OF SURFACE MOUNT DEVICE

Partial heating

method

Infrared Ray Reflow

Soldering process

Soldering conditions

Symbol