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OP275GSZ 데이터시트(PDF) 3 Page - Analog Devices |
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OP275GSZ 데이터시트(HTML) 3 Page - Analog Devices |
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3 / 12 page ![]() –2– OP275–SPECIFICATIONS OP275 –3– ABSOLUTE MAXIMUM RATINGS1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V Differential Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . ±7.5 V Output Short-Circuit Duration to GND3 . . . . . . . . . . Indefinite Storage Temperature Range P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C Operating Temperature Range OP275G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C Junction Temperature Range P, S Packages . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . . . .300°C Package Type JA 4 JC Unit 8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SOIC (S) 158 43 °C/W NOTES 1Absolute maximum ratings apply to packaged parts, unless otherwise noted. 2For supply voltages greater than ±22V, the absolute maximum input voltage is equal to the supply voltage. 3Shorts to either supply may destroy the device. See data sheet for full details. 4JA is specified for the worst-case conditions, i.e., JA is specified for device in socket for PDIP packages; JA is specified for device soldered in circuit board for SOIC packages. ORDERING GUIDE Model Temperature Range Package Description Package Option OP275GP –40°C to +85°C 8-Lead PDIP N-8 OP275GS –40°C to +85°C 8-Lead SOIC R-8 OP275GS-REEL –40°C to +85°C 8-Lead SOIC R-8 OP275GS-REEL7 –40°C to +85°C 8-Lead SOIC R-8 OP275GSZ* –40°C to +85°C 8-Lead SOIC R-8 OP275GSZ-REEL* –40°C to +85°C 8-Lead SOIC R-8 OP275GSZ-REEL7* –40°C to +85°C 8-Lead SOIC R-8 *Z = Pb-free part. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP275 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. C REV. C |
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