● USP-3 Power Dissipation

Power dissipation data for the USP-3 is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as one of reference data taken in the described condition.

1. Measurement Condition (Reference data)

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6 mm

Through-hole: 4 x 0.8 Diameter

2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max = 125℃)

85

25

Thermal Resistance(℃/W)

Power Dissipation Pd（mW）

Ambient Temperature（℃）

100.00

400

1000

Pd vs Ta

0

200

400

600

800

1000

1200

25

45

65

85

105

125

Ambient Temperature Ta（℃）

Evaluation Board (Unit: mm)