Changes

AN1235

12/14

Doc ID 7272 Rev 8

ONYX32 Key Features

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Fully automated X,Y,Z and theta control

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Fully automated alignment using digital feature separation (DFS) technology

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Precision force sensor and mass flow controller

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Four zone bottom preheater

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Flux dipping station

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FireWire (IEEE 1394) controls

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Visual machines software

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Machine table including power supply cabinet

ONYX32 Options

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Dispensing head for solder paste, flux, underfill or adhesives

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Non-contact temperature sensor

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Site solder removal system

6

Changes

STMicroelectronics reserves the right to implement minor changes of geometry and

manufacturing processes without prior notice. Such changes will not affect the electrical

characteristics of the die, the pad layout or the maximum die size. However for confirmed

orders, no variation will be made without the customer’s approval.

7

Quality

7.1

Electrical inspection

Products in Flip Chip are 100% electrically probed according to the critical parameters of the

ST product specification. The last operation before packing is 100% electrical testing. The

other parameters are guaranteed by technology, design rules and by continuous monitoring

systems.

7.2

Visual inspection

A visual control is performed on all manufacturing lots according to the MIL-STD-883

method 2010.