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UM0442 데이터시트(PDF) 13 Page - STMicroelectronics

부품명 UM0442
상세설명  Multiple application platform based on STR750FV2
PDF  33 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

UM0442 데이터시트(HTML) 13 Page - STMicroelectronics

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UM0442
Hardware configuration and functionality
13/33
The USB-OTG standard defines only one-to-one connection. Contrary to the standard USB
there are no USB Hubs defined by the USB-OTG. Connecting the USB hub between two
OTG devices leads to losing all USB-OTG capabilities.
4.10
JTAG connector
To allow enabling of debug features as well as programming capabilities, the STR750-MAP
is equipped with a standard JTAG connector.
Figure 11 below shows how the pins and the corresponding signals are placed in the JTAG
connector.
Figure 11.
The JTAG connector
4.11
On-board sensors
As described in the features list of the board, the STR750-MAP is provided with one 3-axis
digital MEMS accelerometer (the LIS3LV02DQ) and one analog temperature sensor (the
STLM20).
Both sensors are mounted with their package size (QFN28 and UDFN4 package
respectively).
While the temperature sensor provides only the analog output (connected to the ADC
channel 0, pin number 2 in the microcontroller pin-out), the accelerometer could output both
I2C and SPI digital serial output. As a design choice, the STR750-MAP allows the on-board
accelerometer to communicate with the STR750FV2 using only the I2C serial bus (the CS
pin is fixed at 3.3 V).
The board offers the possibility to disconnect this I2C bus from the accelerometer, allowing
the microcontroller to communicate with external peripherals using this bus at 3.3 V as Vcc
with both standard and fast protocol variants.
To manage these settings, refer to Section 4.16: I2C and BSPI connectors on page 18 .
The packages are described in Figure 12, where on the left side is the QFN28 package of
the accelerometer, and on the right side is the UDFN4 package of the temperature sensor.
Refer to the device datasheet in the Reference section for further details.



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