| 전자부품 데이터시트 검색엔진 |
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WEJT81GC-R5 데이터시트(PDF) 6 Page - SHENZHEN YONGERJIA INDUSTRY CO.,LTD |
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WEJT81GC-R5 데이터시트(HTML) 6 Page - SHENZHEN YONGERJIA INDUSTRY CO.,LTD |
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6 / 6 page ![]() Precaution in use Storage Recommended storage environment Temperature: 5℃-30℃(41F~86F) Humidity: 60%RH Max Use within 3days after opening of sealed vapor/ESD barrier bags. Fold the opened bag firmly and keep in dry environment. Soldering Reflow Soldering Hand Soldering Pre-heat Pre-heat time Peak temperature Soldering time Condition Lead Soldering Lead-free Solder Temperature Soldering time 350℃ Max 3sec Max (onetime only) 120~150℃ 180~200℃ 120secMax 120sec Max 240℃Max 260℃Max 10sec Max 10secMax Refer to Refer to Temperature- profile1 Temperature- profile1 After reflow soldering rapid cooling should be avoided. Temperature –profile(Surface of circuit board) Use the conditions shown to the under figure. 深圳市永而佳电子有限公司 WEJ ECELTRONIC CO., LTD SMD |
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