1

2

3

4

5

Drain-Source Leakage Current

Gate-Source Threshold Voltage

Drain-Source On Resistance

Drain-Source On Resistance

Forward Transconductance

Forward On Voltage

Reverse Recovery Time

Reverse Recovery Charge

Drain-Source Breakdown Voltage

Gate-Source Leakage Current

N-Channel (Q2,Q4,Q6)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

P-CHANNEL (Q1,Q3,Q5)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

BODY DIODE

ABSOLUTE MAXIMUM RATINGS

f=1MHz

f=1MHz

Parameter

Units

MSK3003

Test Conditions

V

μA

μA

nA

V

V

Ω

Ω

Ω

Ω

S

S

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

V

V

nS

nS

μC

μC

Min.

55

-

-

-

2.0

-2.0

-

-

-

-

4.5

2.5

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Typ.

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

4.9

34

19

27

370

140

65

-

-

-

13

55

23

37

350

170

92

1.3

-1.6

56

47

0.12

0.084

Max.

-

25

-25

±100

4.5

-4.5

0.15

0.28

0.07

0.175

-

-

20

5.3

7.6

-

-

-

-

-

-

-

19

5.1

10

-

-

-

-

-

-

-

-

-

83

71

0.18

0.13

ELECTRICAL SPECIFICATIONS

2

1

3

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

NOTES:

This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.

Resistance as seen at package pins.

Resistance for die only; use for thermal calculations.

Internal solder reflow temperature is 180°C, do not exceed.

4

2

Drain to Source Voltage

Drain to Gate Voltage

(RGS=1MΩ)

Gate to Source Voltage

(Continuous)

Continuous Current

Pulsed Current

Single Pulse Avalanche Energy

(Q1,Q4)

(Q2,Q3)

JunctionTemperature

Storage Temperature Range

Case Operating Temperature Range

Lead Temperature Range

(10 Seconds Lead Only)

Thermal Resistance (Junction to Case)

P-Channel @ 25°C

P-Channel @ 125°C

N-Channel @ 25°C

N-Channel @ 125°C

+175°C MAX

-55°C to +150°C

-55°C to +125°C

200°C MAX

9.7°C/W

14.5°C/W

9.7°C/W

14.5°C/W

55V MAX

55V MAX

±20V MAX

10A MAX

25A MAX

71mJ

96mJ

5

8548-138 Rev. J 10/14