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AN2386 데이터시트(PDF) 25 Page - STMicroelectronics

부품명 AN2386
상세설명  How to achieve the threshold voltage thermal coefficient
PDF  30 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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AN2386 데이터시트(HTML) 25 Page - STMicroelectronics

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AN2386
Case of DEVICE3
25/30
3
Case of DEVICE3
The device DEVICE3 has similar characteristics of DEVICE1 in terms of tox (470Å), gate
doping (1e+20cm-3), silicon doping (2.4e+17cm-3) and breakdown voltage 55V. The main
difference between the two devices consists in the channel length (0.8µm) and the source
doping thermal process activation; DEVICE3 perform a form while DEVICE1 an RTA
thermal process.
The only difference on the length channels between the two devices should not have an
effect on the threshold voltage and TVTC. Instead, the different source thermal process
doping activation could bring a variation on the TVTC because the net charge peak
concentration in the channel near the source well is higher in the silicon processed in the
form compared to the RTA one. In fact, when the net charge concentration in the silicon
overcomes typically 1e+17[cm-3], a band-gap narrowing effect occurs (see Figure 27.)
because new impurity band states are created inside the forbidden silicon band near the
conduction and valence edges.
Figure 27.
Energy band diagram at low and high doping concentration
In order to consider this effect the Slotboom-De Graaf model is used.
Equation 46
∆Eg is the band-gap narrowing value; NT (expressed in cm-3) is the net charge
concentration (the sum of acceptor and donor doping elements concentration).
The net charge concentration is not easy to establish so, in order to fit the real data, a net
charge concentration of 3.5e+17cm-3 was considered for DEVICE3.
The real data on DEVICE3 using RTA process are shown in the following figures where are
compared to the simulated and the data of the device using the form process.
E
g
∆
b
1T
N
T
10
17
------------
-----
ln


 2
0.5
+
1
2
---
+
ln





=



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