DocID024655 Rev 3

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TN1037

Cooling techniques and heatsink mounting proposals

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thermal impedance of the Al-plate of 18°C/W. The specific shape and the placing of a

thermal foil between the heatsink and the topside of the SLLIMM-nano ensure the creepage

and clearance distances between the heatsink and the shorter edge of the package. As

stated previously for the other mounting techniques, in order to greatly reduce the stress on

the leads and on the PCB, an insulating spacer can be placed between the bottom side of

the SLLIMM-nano and the PCB.

Figure 15. Al-plate heatsink bonded on the PCB by mounting screws

Finally, a large number of solutions may exist based on application requirements, which

could take advantage of metal housing in which the board may eventually be mounted.