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TN1171 데이터시트(PDF) 21 Page - STMicroelectronics |
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TN1171 데이터시트(HTML) 21 Page - STMicroelectronics |
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21 / 26 page ![]() DocID026092 Rev 3 21/26 TN1171 X-Ray inspections 26 12 X-Ray inspections X-ray is one way to detect solder shorts underneath the DFN package. X-rays transmitted from the X-ray tube are absorbed by the components in proportion to their density. In this case, a solder joint having a higher density absorbs most of the X-rays, and the resultant X- ray intensity is detected and interpreted in a gray scale image. The X-ray image is also a good instrument to view solder voids in the exposed pad region. |
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