4

LT1236

ELECTRICAL C

C

realized by preconditioning the IC with a 100-200 hour, 125

°C burn in.

Long term stability will also be affected by differential stresses between the

IC and the board material created during board assembly. Temperature

cycling and baking of completed boards is often used to reduce these

stresses in critical applications.

Note 7: Hysteresis in output voltage is created by package stress that

differs depending on whether the IC was previously at a higher or lower

temperature. Output voltage is always measured at 25

°C, but the IC is

cycled to 50

°C or 0°C before successive measurements. Hysteresis is

roughly proportional to the square of temperature change. Hysteresis is

not normally a problem for operational temperature excursions, but can be

significant in critical narrow temperature range applications where the

instrument might be stored at high or low temperatures.

CC

HARA TERISTICS

A

TYPICALPERFOR

CE

Ripple Rejection

INPUT VOLTAGE (V)

0

85

90

95

100

105

10

20

30

40

LT1236 G01

110

115

515

25

35

f = 150Hz

LT1236-5

LT1236-10

FREQUENCY (Hz)

10

90

110

130

120

100

80

60

100

1k

10k

LT1236 G02

70

50

LT1236-5

LT1236-10

Ripple Rejection

Minimum Input/Output

Differential, LT1236-10

OUTPUT CURRENT (mA)

0

1.2

1.6

16

LT1236 G03

0.8

0.4

0

4

8

12

20

1.0

1.4

0.6

0.2

14

2

6

10

18

Start-Up (Series Mode)

TIME (

µs)

3

4

6

7

8

13

10

2

6

8

LT1236 G04

5

11

12

9

04

10

12

14

LT1236-10

LT1236-5

Start-Up (Shunt Mode), LT1236-10

Output Voltage Noise Spectrum

FREQUENCY (Hz)

100

200

250

350

400

10

1k

1M

LT1236 G06

0

100

300

150

50

LT1236-10

LT1236-5

TIME (

µs)

9

10

11

48

LT1236 G05

8

7

02

610

12

6

5

LT1236-10

IN

GND

OUT

NC

1k

0V