CREAT BY ART

- Glass passivated junction chip

- Ideal for automated placement

- Fast switching for high efficiency

- Moisture sensitivity level: level 1, per J-STD-020

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

RAL

RBL

RDL

RGL

RJL

RKL

RML

50

100

200

400

600

800

1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800

1000

V

A

Cj

pF

Trr

250

ns

Document Number: DS_D1405034

Version: K14

RS1AL thru RS1ML

Taiwan Semiconductor

Surface Mount Fast Recovery Rectifiers

FEATURES

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

RS1

DL

RS1

GL

MECHANICAL DATA

Case:

Sub SMA

Sub SMA

Polarity:

Indicated by cathode band

Weight:

0.019 g (approximately)

RS1

JL

RS1

KL

RS1

ML

UNIT

Marking code

Maximum repetitive peak reverse voltage

PARAMETER

SYMBOL

RS1

AL

RS1

BL

Maximum RMS voltage

Maximum DC blocking voltage

Maximum average forward rectified current

0.8

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

30

A

Maximum instantaneous forward voltage (Note 1)

@ 0.8 A

1.3

V

5

μA

50

Typical junction capacitance (Note 2)

10

Maximum reverse recovery time (Note 3)

150

500

Typical thermal resistance

32

105

Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.

Operating junction temperature range

- 55 to +150

Storage temperature range

- 55 to +150

Note 1: Pulse test with PW=300μs, 1% duty cycle