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LT1425CS 데이터시트(PDF) 16 Page - Linear Technology |
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LT1425CS 데이터시트(HTML) 16 Page - Linear Technology |
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16 / 20 page ![]() 16 LT1425 APPLICATIONS INFORMATION Average supply current (including driver current) is: ISW 35 ) ) IIN = 7mA + DC where, ISW = Switch current DC = On switch duty cycle Switch power dissipation is given by: PSW = (ISW)2(RSW)(DC) RSW = Output switch ON resistance Total power dissipation of the die is the sum of supply current times supply voltage plus switch power: PD(TOTAL) = (IIN • VIN) + PSW FREQUENCY COMPENSATION Loop frequency compensation is performed by connect- ing a capacitor from the output of the error amplifier (VC pin) to ground. An additional series resistor, often required in traditional current mode switcher controllers is usually not required, and can even prove detrimental. The phase margin improvement traditionally offered by this extra resistor will usually be already accomplished by the nonzero secondary circuit impedance, which adds a “zero” to the loop response. In further contrast to traditional current mode switchers, VC pin ripple is generally not an issue with the LT1425. The dynamic nature of the clamped feedback amplifier forms an effective track/hold type response, whereby the VC voltage changes during the flyback pulse, but is then “held” during the subsequent “switch ON” portion of the next cycle. This action naturally holds the VC voltage stable during the current comparator sense action (current mode switching). PCB LAYOUT CONSIDERATIONS For maximum efficiency, switch rise and fall times are made as short as practical. To prevent radiation and high frequency resonance problems, proper layout of the com- ponents connected to the IC is essential, especially the power paths (primary and secondary). B field (magnetic) radiation is minimized by keeping output diode, switch pin and output bypass capacitor leads as short as possible. E field radiation is kept low by minimizing the length and area of all traces connected to the switch pin. A ground plane should always be used under the switcher circuitry to prevent interplane coupling. The high speed switching current paths are shown sche- matically in Figure 2. Minimum lead length in these paths are essential to ensure clean switching and minimal EMI. The path containing the input capacitor, transformer pri- mary, output switch, the path containing the transformer secondary, output diode and output capacitor are the only ones containing nanosecond rise and fall times. Keep these paths as short as possible. HIGH FREQUENCY CIRCULATING PATH • • VOUT VIN HIGH FREQUENCY CIRCULATING PATH ISOLATED LOAD 1425 F02 F Figure 2 |
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